Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2009-02-09
2011-10-11
Nguyen, Dao (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C438S015000
Reexamination Certificate
active
08035203
ABSTRACT:
An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the over-molded leadframe package are disclosed. The over-molded leadframe package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip.
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Buer Kenneth V.
Lyons Michael R.
Torkington Richard S.
Nguyen Dao
Nguyen Tram H
Snell & Wilmer L.L.P.
ViaSat Inc.
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