Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2005-08-02
2009-02-10
Loke, Steven (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S666000, C438S106000
Reexamination Certificate
active
07489022
ABSTRACT:
An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the QFN package are disclosed. The QFN package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip.
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International Search Report dated Sep. 1, 2006.
Agar, Jr., Bill T., Deborah S. Bowser, Kenneth V. Buer and David W. Corman. “A Novel High Frequency Bond Wire Interface.” Technical Developments, vol. 21, Feb. 1994, pp. 102-103.
Buer Kenneth V
Lyons Michael R
Torkington Richard S
Loke Steven
Nguyen Tram H
Snell & Wilmer LLP
Viasat, Inc.
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