Re-routing lead frame package and semiconductor memory package u

Details Re-routing lead frame package and semiconductor memory package u Re-routing lead frame package and semiconductor memory package u

1999-07-02

2000-02-22

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, H01L 23495

Patent

active

060283491

ABSTRACT:
The present invention discloses a semiconductor memory stack including two semiconductor memory packages stacked together. The semiconductor memory packages are electrically connected by pins. At least one of the semiconductor memory packages has a lead frame provided with a re-routing pin connected to a laterally extended conductive layer. According to the present invention, a memory device with a larger capacity can be obtained by stacking two semiconductor memory packages with a smaller capacity, thereby reducing the cost and simplifying the manufacturing process.

REFERENCES:
patent: 5229639 (1993-07-01), Hansen et al.
patent: 5331201 (1994-07-01), Nishino
patent: 5886396 (1999-03-01), Caeney et al.
patent: 5903050 (1999-05-01), Thuairajaratnam et al.
patent: 5907184 (1999-05-01), Corisis et al.
patent: 5914529 (1999-06-01), King et al.

Affiliated with

Also associated with

Rating

Re-routing lead frame package and semiconductor memory package u does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Re-routing lead frame package and semiconductor memory package u, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Re-routing lead frame package and semiconductor memory package u will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-522675