Reframed chip-on-tape die

Details Reframed chip-on-tape die Reframed chip-on-tape die

1997-08-07

1999-11-23

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257787, H01L 23495

Patent

active

059905433

ABSTRACT:
A die is unpackaged from a Chip on Tape by grinding off molding compound from an upper surface of the COT until the COT's leads are evenly exposed across the upper surface, selectively etching out the leads using the remaining molding compound as a mask, removing an underlying layer of gold plating, and then removing the remaining molding compound. The unpacked die can then be reframed with new leads and molding compound for failure analysis and electrical failure verification.

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