Reinforced lead-frame assembly for interconnecting circuits...

Details Reinforced lead-frame assembly for interconnecting circuits... Reinforced lead-frame assembly for interconnecting circuits...

2005-11-15

2005-11-15

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S679000, C257S787000, C438S106000

Reexamination Certificate

active

06965159

ABSTRACT:
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

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