Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-07-26
2005-07-26
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S670000, C257S782000, C257S787000, C257S788000
Reexamination Certificate
active
06921967
ABSTRACT:
A semiconductor package comprising a die pad defining opposed top and bottom surfaces and a peripheral edge. Attached to the peripheral edge of the die pad is a plurality of support feet which extend downwardly relative to the bottom surface thereof. A plurality of leads extend at least partially about the peripheral edge of the die pad in spaced relation thereto. Attached to the top surface of the die pad is a semiconductor die which is electrically connected to at least one of the leads. A package body encapsulates the die pad, the support feet, the leads and the semiconductor die such that at least portions of the leads are exposed in the package body.
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Chen Kuang-Yang
Ho Hsi-Hsun
Liao June-Wen
Shih Jun-Chun
Tan Kuo-Chang
Amkor Technology Inc.
Huynh Andy
Stetina Brunda Garred & Brucker
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