Plastic surface mount large area power device
Plastic-encapsulated semiconductor device and fabrication...
Plastic-molded semiconductor device containing a semiconductor p
Plastic-molded type semiconductor device
Plastic-molded-type semiconductor device
Plate for supporting a punched leadframe
Plated leadframes with cantilevered leads
Plurality of arrangements each including an IC magnetic field se
Polytetrafluoroethylene thin film chip carrier
Post-passivation thick metal pre-routing for flip chip...
Power chip scale package
Power device package comprising metal tab die attach paddle...
Power LED package
Power management integrated circuit
Power module having a heat sink
Power module package having improved heat dissipating...
Power module package having improved heat dissipating...
Power module package structure
Power module with closely spaced printed circuit board and...
Power semiconductor component having a topmost metallization...