Plastic-molded-type semiconductor device

Details Plastic-molded-type semiconductor device Plastic-molded-type semiconductor device

1991-06-11

1996-07-23

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257723, 257725, 257787, H01L 2334

Patent

active

055392504

ABSTRACT:
A plastic-molded-type semiconductor device is provided wherein two semiconductor chips, having main surfaces on which electrodes and circuits are formed, are arranged to face each other. A lead frame is placed between these two semiconductor chips and electrically connected to their electrodes, and a plastic package is formed by plastic-sealing the above components. To provide for secure and convenient electrical connections between the electrodes on the semiconductor chips and the lead frame, wiring patterns are provided on the main surfaces of the semiconductor chips through the intermediation of insulating films. With this structure, it is possible for two large-sized semiconductor chips having electrodes in their middle sections to be encased in a single, relatively thin package.

REFERENCES:
patent: 3893158 (1975-07-01), Lincoln
patent: 4005456 (1977-01-01), Botzenhardt
patent: 4486945 (1984-12-01), Aigoo
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4862322 (1989-08-01), Bickford et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5332922 (1994-07-01), Oguchi et al.

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