Power management integrated circuit

Details Power management integrated circuit Power management integrated circuit

2007-07-24

2007-07-24

Coleman, William David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000, C257SE23101

Reexamination Certificate

active

10955383

ABSTRACT:
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.

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Tschanz, James W. et al. “Adaptive Body Bias for Reducing Impacts of Die-to-Die and Within-Die Parameter Variations on Microprocessor Frequency and Leakage”. IEEE Journal of Solid-State Circuits, vol. 37, No. 11, Nov. 2002.

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