Power module package structure

Details Power module package structure Power module package structure

2008-07-29

2008-07-29

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

C257S692000, C257S724000, C257S784000, C257SE23031, C257SE23043, C361S772000, C361S813000, C029S827000, C029S830000, C438S123000

Reexamination Certificate

active

07405467

ABSTRACT:
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

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patent: 2002-0071585 (2002-09-01), None

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