Plate for supporting a punched leadframe

Details Plate for supporting a punched leadframe Plate for supporting a punched leadframe

1993-03-12

1994-03-15

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257706, H01L 2340, H01L 2914, H01L 2952, H01L 2960

Patent

active

052948285

ABSTRACT:
A leadframe support plate, particularly a heater plate, for a wire bonding apparatus comprises a frame supporting face, and a die-pad supporting face for supporting a die pad of a leadframe. The die-pad supporting face is formed with at least one burr receiving groove extending along the marginal contour of the die pad, so that the die pad of the leadframe is supported stably on the die-pad supporting face even if the marginal of the die pad has burrs.

REFERENCES:
patent: 5175060 (1992-12-01), Enomoto et al.

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