Plastic-molded type semiconductor device

Details Plastic-molded type semiconductor device Plastic-molded type semiconductor device

1993-01-08

1993-09-14

Mottola, Steven

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257691, 257711, 257723, 257724, 257787, 257796, H01L 2328

Patent

active

052452166

ABSTRACT:
A plastic-molded type semiconductor device according to the present invention has two islands, on which semiconductor elements are mounted. An insulating circuit board is formed so as to extend over the two islands. On the insulating circuit board, wires are formed. Resin is molded so as to cover the two islands and insulating circuit board. The insulating circuit board overlaps the two islands only at its edges, so that there exists no island just below the insulating circuit board. This reduces the island area and makes it harder for resin cracks to occur, compared with a conventional equivalent.

REFERENCES:
patent: 4962415 (1990-10-01), Yamamoto
patent: 5049977 (1991-09-01), Sako

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