Power module having a heat sink

Details Power module having a heat sink Power module having a heat sink

2005-08-23

2005-08-23

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S666000, C257S691000, C257S692000, C257S698000, C257S723000, C257S724000, C257S690000

Reexamination Certificate

active

06933593

ABSTRACT:
A power module that includes a molded shell having a lead frame molded in a mold body, and a plurality of power semiconductor devices disposed directly on the die pads of the lead frame.

REFERENCES:
patent: 6359331 (2002-03-01), Rinehart et al.
patent: 6384492 (2002-05-01), Iversen et al.
patent: 6841852 (2005-01-01), Luo et al.

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