Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2008-01-08
2011-11-29
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23040, C257S666000, C257S691000, C438S123000
Reexamination Certificate
active
08067826
ABSTRACT:
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.
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Jeon O-seob
Lee Byoung-ok
Lee Taek-keun
Son Joon-Seo
Chu Chris
Fairchild Korea Semiconductor Ltd.
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
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