Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1997-01-28
1998-08-25
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257700, 257702, 257698, 257759, 257642, 438125, 361795, 174255, H01L 23495, H01L 2304, H01L 2348, H01L 2352
Patent
active
057985634
ABSTRACT:
The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 3.5% The invention also relates to methods of making the dielectric coated chip carrier.
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"High Performance, Organic Single Chip Package" by Petefish, et al., Proceedings 1996 International Symposium on Microelectronics (SPIE) vol. 2920, Oct. 1996, pp. 249-253.
Feilchenfeld Natalie Barbara
Kresge John Steven
Moore Scott Preston
Nowak Ronald Peter
Wilson James Warren
Clark Jhihan B.
International Business Machines - Corporation
Saadat Mahshid D.
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