Unit semiconductor chip and multi chip package with center...
Unitary silicon die module
Universal interconnect die
Universal land grid array socket engagement mechanism
Universal pad arrangement for surface mounted semiconductor...
Universal substrate for a semiconductor device having...
Use of a reference fiducial on a semiconductor package to...
Use of solder paste for heat dissipation
Use of tantalum oxide capacitor on ceramic co-fired technology
Using a thermal barrier to provide a hermetic seal surface on al
Using adhesive materials as insulation coatings for leadless...
Using external radiators with electroosmotic pumps for...
Utilization of die active surfaces for laterally extending...
Utilization of die repattern layers for die internal connections