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Tape having implantable conductive lands for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Tape stiffener, semiconductor device component assemblies...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Tape substrate and semiconductor module for smart card,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Tape wiring substrate and chip-on-film package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Tape wiring substrate and chip-on-film package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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TBGA semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Technique for attaching die to leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Technique for manufacturing an overmolded electronic assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Techniques for joining an opto-electronic module to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
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Techniques for joining an opto-electronic module to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Techniques for manufacturing a circuit board with an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Techniques for optimizing electrical performance and layout...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Techniques for optimizing electrical performance and layout...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Techniques for packaging multiple device components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Techniques for reducing bowing in power transistor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Temporary coatings for protection of microelectronic devices...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Tenon-and-mortise packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Tented plated through-holes and method for fabrication thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Terminal arrangement for an SMD-capable hybrid circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Terminal configuration in semiconductor IC device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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