Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2008-09-17
2010-12-07
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S679000, C257S685000, C257SE23034, C257SE23055, C439S607220
Reexamination Certificate
active
07847380
ABSTRACT:
Provided are a tape substrate for a smart card, a method of fabricating the same, and a semiconductor module and a smart card using the tape substrate. The tape substrate includes at least one tape unit. The at least one tape unit includes a chip mounting unit defining a region on which a semiconductor chip is to be mounted, a plurality of pin electrode units arranged around the chip mounting unit and separated from one another, a border unit encircling the chip mounting unit and the pin electrode units, and a cutting unit disposed between the chip mounting unit and the border unit and between the pin electrode units and the border unit. The cutting unit includes a plurality of connection lines connecting the chip mounting unit and the pin electrode units to the border unit.
REFERENCES:
patent: 6235555 (2001-05-01), Cho
patent: 6472733 (2002-10-01), Le Loc'h
patent: 6513718 (2003-02-01), Bouchez et al.
patent: 6709889 (2004-03-01), Gore et al.
patent: 2004-266109 (2004-09-01), None
patent: 2006-179512 (2006-06-01), None
patent: 10-0651796 (2006-11-01), None
Clark Jasmine J
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
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