Tenon-and-mortise packaging structure

Details Tenon-and-mortise packaging structure Tenon-and-mortise packaging structure

2011-06-21

2011-06-21

Thomas, Tom (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE23180

Reexamination Certificate

active

07964949

ABSTRACT:
A tenon-and-mortise packaging structure including a carrier and a chip is provided. The carrier has a top surface and a lower surface opposite to the top surface. The top surface forms at least one tenon projection, and the lower surface forms a mortise slot corresponding to the tenon projection in shape, size, and position, so that two carriers can be stacked on and jointed to each other by coupling the tenon projection to the corresponding mortise slot. The tenon projection and the mortise slot have conduction portions, respectively. When the tenon projection and the mortise slot are engaged with each other, the conduction portions are electrically connected with each other. At least one chip is embedded in the carrier. The chip has an active surface and a back side respectively and electrically connected with the top and the lower surfaces of the carrier.

REFERENCES:
patent: 2007/0155048 (2007-07-01), Lee et al.

Affiliated with

Also associated with

Rating

Tenon-and-mortise packaging structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tenon-and-mortise packaging structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tenon-and-mortise packaging structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2659649