Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-09-11
2007-09-11
Lee, Hsien-Ming (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257S720000, C438S121000, C438S122000
Reexamination Certificate
active
11167473
ABSTRACT:
A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.
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Brandenburg Scott D.
Degenkolb Thomas A.
Laudick David A.
Tsai Jeenhuei S.
Walsh Matthew R.
Delphi Technologies Inc.
Funke Jimmy L.
Lee Hsien-Ming
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