LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Semiconductor package with lid heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Semiconductor package with lid heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Semiconductor package with low strain seal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Semiconductor package with low strain seal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Semiconductor package with mechanical stress isolation of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Semiconductor package with metalized portions

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Semiconductor package with molded substrate and recessed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package with multilayer circuit, and semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Semiconductor package with offset die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Semiconductor package with passive elements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package with patterning layer and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package with plated connection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package with plated connection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Semiconductor package with pre-fabricated cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Semiconductor package with reduced inductive coupling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package with reduced length interconnect and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package with sloped outer leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package with stacked chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package with stacked chips and method for...