Semiconductor package with reduced inductive coupling...

Details Semiconductor package with reduced inductive coupling... Semiconductor package with reduced inductive coupling...

2008-06-26

2011-10-04

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S773000, C257S776000, C257S784000, C257S786000, C257SE23010, C257SE23141, C330S169000, C330S170000, C330S286000

Reexamination Certificate

active

08030763

ABSTRACT:
A semiconductor package (20) includes circuits (22, 24). The circuit (22) includes electrical devices (52, 54) interconnected by a bondwire array (62). Likewise, the circuit (24) includes electrical devices (58, 60) interconnected by a bondwire array (64). Signal wires (76) of the bondwire array (62) are proximate to signal wires (78) of the bondwire array (64). Ground wires (66, 68) are located on either side of, and close to, bondwire array (62). Ground wires (70, 72) are located on either side of, and close to, bondwire array (64). The ground wires (66, 68, 70,72) are electrically coupled to a ground region (74). The ground wires (66, 68, 70, 72) reduce a magnetic flux density (140) via induced return currents (126, 130) on the ground wires of opposite polarity to signal currents (124, 128) on the bondwire arrays (62, 64) to reduce inductive coupling between the adjacent bondwire arrays (62, 64).

REFERENCES:
patent: 4686492 (1987-08-01), Grellmann et al.
patent: 5004317 (1991-04-01), Jackson et al.
patent: 7061329 (2006-06-01), Inoue et al.
patent: 7295074 (2007-11-01), Wong et al.
patent: 2005/0087856 (2005-04-01), Joiner et al.
patent: 2007/0235855 (2007-10-01), Bokatius et al.

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