Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-07-01
2008-07-01
Smith, Matthew S. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S693000, C257SE21511
Reexamination Certificate
active
07394151
ABSTRACT:
A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.
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Liu Kai
Luo Leeshawn
Sun Ming
Zhang Xiao Tian
Alpha & Omega Semiconductor Limited
Nguyen Khiem D
Smith Matthew S.
Van Pelt & James LLP
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