Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-03-12
1999-11-02
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257710, 257747, 257729, H01L 2312
Patent
active
059776250
ABSTRACT:
A semi-conductor packaging structure and a method to reduce the seal strain of the package are disclosed. The structure comprises a cap, substrate, seal and the cap and substrate have a predetermined TCE mismatch. The TCE mismatch between the cap and substrate is predetermined to minimize the seal strain during power-on and power-off use conditions. Preferably, the device has a substrate comprises a ceramic material, a cap with a thermal conductivity of at least about 100 W/m-K. A method of selecting a cap material is disclosed.
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Coico Patrick Anthony
Edwards David Linn
Farooq Shaji
Sherif Raed A.
Toy Hilton T.
Capella Steven
Clark Sheila V.
International Business Machines - Corporation
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