Superconducting apparatus having dew-preventable Peltier-effect
Superposed printed substrates and insulating substrates...
Support assembly for an integrated circuit package having...
Support elements for semiconductor devices with peripherally...
Support for microelectronic, microoptoelectronic or...
Support structure for power element
Support structure for use in thinning semiconductor...
Support structures for on-wafer testing of wafer-level...
Support with integrated deposit of gas absorbing material...
Supporting a circuit package including a substrate having a...
Supporting a circuit package including a substrate having a...
Supporting frame for surface-mount diode package
Supporting frame for surface-mount diode package
Supporting member for cooling means and electronic package using
Surface mount adapter apparatus and methods regarding same
Surface mount adapter apparatus and methods regarding same
Surface mount and flip chip technology with diamond film passiva
Surface mount ceramic package
Surface mount IC using silicon vias in an area array format or s
Surface mount ic using silicon vias in an area array format...