Support structure for use in thinning semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Reexamination Certificate

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C257SE23083, C257SE23188

Reexamination Certificate

active

07960829

ABSTRACT:
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member that substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.

REFERENCES:
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 5114880 (1992-05-01), Lin
patent: 5121256 (1992-06-01), Corle et al.
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5460703 (1995-10-01), Nulman et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5610683 (1997-03-01), Takahashi
patent: 5675402 (1997-10-01), Cho et al.
patent: 5703493 (1997-12-01), Weeks et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5723385 (1998-03-01), Shen et al.
patent: 5803797 (1998-09-01), Piper
patent: 5824457 (1998-10-01), Liu et al.
patent: 5827394 (1998-10-01), Lu
patent: 5833869 (1998-11-01), Haas et al.
patent: 5843527 (1998-12-01), Sanada
patent: 5869354 (1999-02-01), Leedy
patent: 5919520 (1999-07-01), Tateyama et al.
patent: 5953590 (1999-09-01), Piper et al.
patent: 6018463 (2000-01-01), Winslow et al.
patent: 6033589 (2000-03-01), Lin
patent: 6039830 (2000-03-01), Park et al.
patent: 6040248 (2000-03-01), Chen et al.
patent: 6042976 (2000-03-01), Chiang et al.
patent: 6048948 (2000-04-01), Tochioka
patent: 6111306 (2000-08-01), Kawahara et al.
patent: 6114253 (2000-09-01), Jang et al.
patent: 6140151 (2000-10-01), Akram
patent: 6143590 (2000-11-01), Ohki et al.
patent: 6150240 (2000-11-01), Lee et al.
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6245646 (2001-06-01), Roberts
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6284044 (2001-09-01), Sakamoto et al.
patent: 6303469 (2001-10-01), Larson et al.
patent: 6322598 (2001-11-01), Meuris et al.
patent: 6323295 (2001-11-01), Muhlebach et al.
patent: 6326698 (2001-12-01), Akram
patent: 6338982 (2002-01-01), Beroz et al.
patent: 6339255 (2002-01-01), Shin
patent: 6344402 (2002-02-01), Sekiya
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6399464 (2002-06-01), Muntifering et al.
patent: 6413150 (2002-07-01), Blair
patent: 6432752 (2002-08-01), Farnworth
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6462273 (2002-10-01), Corisis et al.
patent: 6462401 (2002-10-01), Fujii
patent: 6465329 (2002-10-01), Glenn
patent: 6468832 (2002-10-01), Mostafazadeh
patent: 6471806 (2002-10-01), McKenna et al.
patent: 6472294 (2002-10-01), Meuris et al.
patent: 6486939 (2002-11-01), Lin
patent: 6489042 (2002-12-01), Imken et al.
patent: 6498074 (2002-12-01), Siniaguine et al.
patent: 6506688 (2003-01-01), Wu
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6537482 (2003-03-01), Farnworth
patent: 6551906 (2003-04-01), Oka
patent: 6562661 (2003-05-01), Grigg
patent: 6582983 (2003-06-01), Runyon et al.
patent: 6589818 (2003-07-01), Usami et al.
patent: 6593171 (2003-07-01), Farnworth
patent: 6617671 (2003-09-01), Akram
patent: 6621161 (2003-09-01), Miyawaki
patent: 6627997 (2003-09-01), Eguchi et al.
patent: 6680241 (2004-01-01), Okamoto et al.
patent: 6683378 (2004-01-01), Wing et al.
patent: 6686225 (2004-02-01), Wachtler
patent: 6734032 (2004-05-01), Tandy et al.
patent: 6736896 (2004-05-01), Lin
patent: 6740962 (2004-05-01), Grigg
patent: 6746899 (2004-06-01), Grigg
patent: 6749688 (2004-06-01), Tateyama et al.
patent: 6908784 (2005-06-01), Farnworth
patent: 6940181 (2005-09-01), Derderian et al.
patent: 6949158 (2005-09-01), Ball et al.
patent: 6974721 (2005-12-01), Koizumi et al.
patent: 7118938 (2006-10-01), Koh
patent: 7140951 (2006-11-01), Kurosawa
patent: 7244665 (2007-07-01), Benson
patent: 2001/0001740 (2001-05-01), Miyawaki
patent: 2001/0055834 (2001-12-01), Lin
patent: 2002/0091173 (2002-07-01), Hashimoto et al.
patent: 2002/0102819 (2002-08-01), Tamura et al.
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2003/0003688 (2003-01-01), Tandy et al.
patent: 2003/0059708 (2003-03-01), Yamamura et al.
patent: 2003/0077399 (2003-04-01), Ptoyrailo et al.
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2004/0229002 (2004-11-01), Davis et al.
patent: 2005/0064679 (2005-03-01), Farnworth et al.
patent: 2005/0064681 (2005-03-01), Wood et al.
patent: 2005/0064683 (2005-03-01), Farnworth et al.
patent: 2006/0109630 (2006-05-01), Colgan et al.
patent: 0 023 231 (1981-02-01), None
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Objet Prototyping the Future, “Objet FullCure700 Series”, (2003) 2 pages.
Webpage, Objet Prototyping the Future, “How it Works”, (2003) 2 pages.

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