Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-05-13
2008-05-13
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S718000, C257S778000, C438S108000, C361S704000
Reexamination Certificate
active
07372147
ABSTRACT:
A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.
REFERENCES:
patent: 5220200 (1993-06-01), Blanton
patent: 5221209 (1993-06-01), D'Amico
patent: 5402077 (1995-03-01), Agahdel et al.
patent: 5528462 (1996-06-01), Pendse
patent: 5621615 (1997-04-01), Dawson
patent: 5875096 (1999-02-01), Gates
patent: 5907474 (1999-05-01), Dolbear
patent: 5949137 (1999-09-01), Domadia et al.
patent: 5985682 (1999-11-01), Higgins, III
patent: 6198630 (2001-03-01), Cromwell
patent: 6205026 (2001-03-01), Wong et al.
patent: 6252768 (2001-06-01), Lin
patent: 6292369 (2001-09-01), Daves et al.
patent: 6394820 (2002-05-01), Palaniappa et al.
patent: 6404638 (2002-06-01), Messina
patent: 6407450 (2002-06-01), Verma et al.
patent: 6501658 (2002-12-01), Pearson et al.
patent: 6541710 (2003-04-01), Deeney et al.
patent: 6545879 (2003-04-01), Goodwin
patent: 6618251 (2003-09-01), Ishimine
patent: 6639800 (2003-10-01), Eyman et al.
patent: 6750551 (2004-06-01), Frutschy et al.
patent: 6885557 (2005-04-01), Unrein
patent: 2002/0074649 (2002-06-01), Chrysler et al.
patent: 2002/0110335 (2002-08-01), Wagner et al.
patent: 2002/0175404 (2002-11-01), Yoshikawa
patent: 2003/0079861 (2003-05-01), Lee
patent: 2003/0085453 (2003-05-01), Eyman et al.
patent: 2003/0094306 (2003-05-01), Deeney et al.
patent: 2003/0095392 (2003-05-01), Deeney
patent: 2004/0012079 (2004-01-01), Khiang
patent: 2004/0036162 (2004-02-01), Chuang et al.
patent: 2004/0037059 (2004-02-01), Stiborek et al.
patent: 2004/0095728 (2004-05-01), Bird et al.
patent: 2004/0130876 (2004-07-01), Davison
patent: 2004/0134680 (2004-07-01), Dai et al.
patent: 2004/0252462 (2004-12-01), Cromwell et al.
R. Bargerhuff et al., Development of a Large Heatsink Support Structure, Proceedings of NEPCON Texas '97, Dallas, Oct. 1997.
Cromwell Dan
Dai Xiang
Hewlett--Packard Development Company, L.P.
Jr. Carl Whitehead
Mitchell James M
LandOfFree
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