Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-05-13
2008-05-13
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S718000, C257S778000, C438S108000, C361S704000
Reexamination Certificate
active
10612663
ABSTRACT:
A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.
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R. Bargerhuff et al., Development of a Large Heatsink Support Structure, Proceedings of NEPCON Texas '97, Dallas, Oct. 1997.
Cromwell Dan
Dai Xiang
Jr. Carl Whitehead
Mitchell James M
LandOfFree
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