LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Layered chip package and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layered features for co-fired module integration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layout method for thin and fine ball grid array package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layout of Vdd and Vss balls in a four layer PBGA

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layout structure and method for supporting two different...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Layout structure for providing stable power source to a main...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

LDMOS transistor heatsink package assembly and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead formation using grids

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame and flip chip semiconductor package with the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame decoupling capacitor semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame decoupling capacitor, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame decoupling capacitor, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Lead frame design for burr-free singulation of molded array...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame design for increased chip pinout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame for use with an RF powered semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame having chip mounting part and leads of different...