Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-09-20
2005-09-20
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S691000, C257S784000, C257S700000
Reexamination Certificate
active
06946731
ABSTRACT:
This invention relates to a layout structure for providing stable power supply to a four-layer motherboard and a main bridge chip substrate. In the invention, on the top signal layer and power path of the bottom solder layer for layout of the main bridge chip and on the power ring, the decoupling capacitors are connected in between the ground bonding pads/solder balls and the power bonding pads/solder balls of the power paths and power rings, so as to provide a stable power supply for the operation of the main bridge chip. In this invention, the ground bonding pad/solder ball connected with each power bonding pad/solder ball can be the closest ground bonding pad/solder ball to the power bonding pad/solder ball. In addition, in the embodiment of the main bridge chip substrate, decoupling capacitors can be disposed at four corners of the power ring or underneath the bonding wires, or can be packaged inside the molding compound.
REFERENCES:
patent: 5811880 (1998-09-01), Banerjee et al.
patent: 5847451 (1998-12-01), Ohtaki et al.
patent: 5925925 (1999-07-01), Dehaine et al.
Chang Nai-Shung
Chen Shu-Hui
Chen Tsai-Sheng
Yu Chia-Hsing
J. C. Patents
Thai Luan
VIA Technologies Inc.
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