Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-08-30
2005-08-30
Mai, Anh Duy (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S676000, C257S690000
Reexamination Certificate
active
06936915
ABSTRACT:
A lead frame according to this invention comprises: a semiconductor chip mounting part having an engagement hole formed on its one side; and a lead part including a supporting lead fit in said engagement hole of the semiconductor chip mounting part so as to support said semiconductor chip mounting part, said supporting lead being made of a thinner-walled material than that of the semiconductor chip mounting part and an outer lead arranged in parallel to said supporting lead. The supporting lead involves a fitting portion having a wider width than a lead width of the supporting lead and fit in said engagement hole of said semiconductor chip mounting part.
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Duy Mai Anh
Mitsui High-tec Inc.
Wood Phillips Katz Clark & Mortimer
LandOfFree
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