Lead frame

Details Lead frame Lead frame

1992-03-30

1995-04-11

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257772, H01L 2348

Patent

active

054061199

ABSTRACT:
A lead frame includes outer leads each having a thinner portion made by coining, for example, so that a prefabricated tip is formed thereat before the soldering process by cutting the thinner portion. The prefabricated tip is coated with the solder at the soldering stage. Therefore, it is easy to provide stable and reliable connections of leads thus formed to pads of a printed circuit board to mount a semiconductor device having the leads on the printed circuit board.

REFERENCES:
patent: 4722060 (1988-01-01), Quinn et al.

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