Laser diode package

Details Laser diode package Laser diode package

1992-08-10

1993-11-16

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257680, 372 35, H01L 2504

Patent

active

052626750

ABSTRACT:
A semiconductor mounting package is provided which permits the active p-n junction of a light emitting semiconductor to be operated in a liquid heat transfer fluid. The package provides optical coupling for extracting light energy.

REFERENCES:
patent: 2888619 (1959-05-01), Hammes
patent: 2898474 (1956-09-01), Rutz
patent: 3508100 (1967-11-01), Tillays et al.
patent: 3753149 (1973-08-01), Kindl et al.
Patent Abstracts of Japan, vol. 11, No. 41 (E-145) Feb. 6, 1987, & JP, A., 61206284 (Toshiba Corp.) Sep. 12, 1986.
Patent Abstracts of Japan, vol. 2, No. 153 (E-79) Dec. 22, 1978, & JP, A, 53121639 (Mitsubihi Denki D.K. Nov. 24, 1978).
Patent Abstracts of Japan, vol. 13, No. 463 (E-833) Oct. 19, 1989 & JP, A, 01179483 (Canon, Inc.) Jul. 17, 1989.
Resnick et al. "Physics", .COPYRGT.1966, 552-553.
Patent Abstracts of Japan, vol. 8, No. 250 (E-279) Nov. 16, 1984 & JP, A, 59125643 (Fujitsu K.K.) Jul. 20, 1984.
IBM Technical Disclosure Bulletin, vol. 18, No. 7, Dec. 1975, IBM Corp., (Armonk, N.Y., U.S.), H. E. Korth: "Optical Multichannel Connection of Integrated Modules", p. 2187.

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