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Integrated circuit package and system interface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package architecture with improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package architecture with improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package capable of improving signal quality

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package configuration having an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
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Integrated circuit package design with non-orthogonal die...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package electrical enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package electrical enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package electrical enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package electrical enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package electrical enhancement with improved

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package employing a heat-spreader member

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package for flexible computer system alternat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Integrated circuit package for the transfer of heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package having a castellated heatspreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package having a liquid metal-aluminum/copper

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Integrated circuit package having a resistant layer for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated circuit package having a stiffener dimensioned to rec

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package having adhesive bead supporting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package having bond fingers with alternate bo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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