Integrated circuit package having bond fingers with alternate bo

Details Integrated circuit package having bond fingers with alternate bo Integrated circuit package having bond fingers with alternate bo

1997-10-23

1999-12-28

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257784, 257786, 257698, 257696, 257782, 257692, 361712, 361820, 361777, 174 524, 174261, H01L 2352, H01L 2328, H01L 2944, H05K 111

Patent

active

060085320

ABSTRACT:
A leadframe having individual bond fingers incorporating two or more alternate bonding areas. In one embodiment, conventional bond fingers having bonding areas in an outer row are augmented to include an additional conductive trace or intermediate portion terminating in a bonding area that is in general alignment with an inner row of bonding areas. Likewise, bond fingers having bonding areas in an inner row are enlarged to include an alternate bonding area that is in general alignment with the outer row of bonding areas. In another embodiment, bond fingers are arranged to provide multiple rows of closely-spaced staggered bonding areas to reduce bonding pitches. By providing alternate bonding areas in individual bond fingers, the manufacturing rules addressing staggered bond wire placement can be followed more readily, while simultaneously permitting the most convenient bond fingers to be utilized. The invention thereby adds significant flexibility to current staggered bonding techniques, and allows for a reduction in the size of many semiconductor dies.

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