Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1999-04-19
2000-07-11
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257666, 257676, 257691, 257673, 257696, 257698, H01L 23495, H01L 2348, H01L 2944
Patent
active
060877200
ABSTRACT:
A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooling. The present invention utilizes an extended lead finger that extends along the periphery of a semiconductor device to provide a power source or ground so that any number of bond pads may be used in any position without requiring additional leads or tooling changes.
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Brooks Jerry M.
Corisis David J.
Micro)n Technology, Inc.
Williams Alexander Oscar
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