Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1994-05-10
1995-10-17
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257713, 257718, 361705, H01L 3902, H01L 2302
Patent
active
054593522
ABSTRACT:
An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200 .ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100.degree. C.-300.degree. C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.
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Layton Wilber T.
Morange Blanquita O.
Roecker James A.
Torres Angela M.
Axenfeld Robert R.
Clark Jhihan
Crane Sara W.
Fassbender Charles J.
Starr Mark T.
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