Integrated circuit package employing a heat-spreader member

Details Integrated circuit package employing a heat-spreader member Integrated circuit package employing a heat-spreader member

2007-05-29

2007-05-29

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S713000, C257S720000, C257S724000, C257S784000, C257SE23051, C361S704000, C361S709000, C361S710000, C438S122000

Reexamination Certificate

active

11287858

ABSTRACT:
An integrated circuit package is proposed in which a laminar substrate41is provided with an aperture43. A heat-spreader member1is mounted to cover this aperture43, and contains a cavity3opening towards the aperture43in the substrate41. A stack of integrated circuit circuits11, 21, are located with one integrated circuit21of the stack inserted into the cavity3, and one integrated circuit11of the stack electrically connected to the substrate41.

REFERENCES:
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5646828 (1997-07-01), Degani et al.
patent: 6052287 (2000-04-01), Palmer et al.
patent: 6368894 (2002-04-01), Shen
patent: 6369444 (2002-04-01), Degani et al.
patent: 6400035 (2002-06-01), Hirata et al.
patent: 6477046 (2002-11-01), Stearns et al.
patent: 6489686 (2002-12-01), Farooq et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 6501164 (2002-12-01), Chen et al.
patent: 6507107 (2003-01-01), Vaiyapuri
patent: 2002/0068425 (2002-06-01), Chen et al.
patent: 2002/0109226 (2002-08-01), Khan et al.
patent: 2002/0158319 (2002-10-01), Shibata
patent: 2003/0034557 (2003-02-01), Gupta et al.
patent: 0 959 500 (1999-11-01), None
patent: 1 189 280 (2002-03-01), None
patent: 05129516 (1993-05-01), None

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