Integrated circuit package for the transfer of heat...

Details Integrated circuit package for the transfer of heat... Integrated circuit package for the transfer of heat...

2005-02-01

2005-02-01

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S712000, C257S710000, C257S704000, C257S713000, C257S717000, C257S720000, C257S675000, C257S777000, C257S686000, C257S723000, C257S788000, C257S787000, C257S678000, C257S707000, C361S704000, C361S702000, C361S703000

Reexamination Certificate

active

06849940

ABSTRACT:
An integrated circuit package includes a first or active substrate and a second or passive substrate. The active substrate includes at least one circuit that generates heat during circuit operation. The passive substrate does not include any heat-generating circuits, although the passive substrate may include passive, disabled or dormant circuitry. The two substrates are preferably fabricated of semiconductor material and have substantially equal coefficients of thermal expansion. The passive substrate is thermally coupled to the active substrate preferably using a thin layer of adhesive, such as an epoxy. The passive substrate serves to thermally conduct the heat generated by the circuits of the active substrate away from the active substrate. An internal metallic heat sink may be optionally thermally coupled to the passive substrate to further aid in the transfer of heat away from the active substrate.

REFERENCES:
patent: 5424573 (1995-06-01), Kato et al.
patent: 5616957 (1997-04-01), Kajihara
patent: 5977626 (1999-11-01), Wang et al.
patent: 6414385 (2002-07-01), Huang et al.
patent: 6437984 (2002-08-01), Chiu et al.
patent: 6608763 (2003-08-01), Burns et al.
patent: 6703698 (2004-03-01), Huang et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 20010008776 (2001-07-01), Lai et al.
patent: 20020175421 (2002-11-01), Kimura
patent: 20020195270 (2002-12-01), Okubora et al.
patent: 60-154648 (1985-08-01), None
patent: 62-281435 (1987-12-01), None
patent: 08-250652 (1996-09-01), None

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