High bandwidth 3D memory packaging technique
High capacitance package substrate
High capacity memory module using flexible substrate
High capacity memory with stacked layers
High capacity thin module system
High capacity thin module system
High contact density ball grid array package for flip-chips
High current capacity semiconductor device package and lead...
High current capacity semiconductor device package and lead...
High current lead electrode for semiconductor device
High density 3-D integrated circuit package
High density cavity-up wire bond BGA
High density chip carrier with integrated passive devices
High density flip chip memory arrays
High density integrated circuit module
High density integrated circuit package architecture
High density interconnect structure including a chamber
High density memory array packaging
High density memory card assembly
High density memory card assembly