High density memory card assembly

Details High density memory card assembly High density memory card assembly

2008-01-08

2008-01-08

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE25023, C257S685000, C257S686000, C257S777000, C361S761000, C361S764000, C174S260000, C365S232000

Reexamination Certificate

active

07317250

ABSTRACT:
A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate. First and second digital memory devices (e.g., TSOP packages or bare semiconductor dies) are located within the cavity so as to be recessed relative to the top and bottom of the substrate. The recessed first and second memory devices are arranged in spaced, face-to-face alignment with one another within the cavity. The first and second memory devices are covered and protected by respective first and second memory packages that are located on the top and bottom of the substrate. By virtue of the foregoing, the memory package density of the assembly can be increased without increasing the height or area consumed by the assembly for receipt within an existing external housing.

REFERENCES:
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5386343 (1995-01-01), Pao
patent: 5421081 (1995-06-01), Sakaguchi et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5801438 (1998-09-01), Shirakawa et al.
patent: 5831833 (1998-11-01), Shirakawa et al.
patent: 5949135 (1999-09-01), Washida et al.
patent: 6154371 (2000-11-01), Oba et al.
patent: 6160718 (2000-12-01), Vakilian
patent: 6324067 (2001-11-01), Nishiyama
patent: 6333566 (2001-12-01), Nakamura
patent: 6365963 (2002-04-01), Shimada
patent: 6445591 (2002-09-01), Kwong
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6469395 (2002-10-01), Nishihara et al.
patent: 6713854 (2004-03-01), Kledzik et al.
patent: 6777798 (2004-08-01), Fukumoto et al.
patent: 6906415 (2005-06-01), Jiang et al.
patent: 6982485 (2006-01-01), Lee et al.

Affiliated with

Also associated with

Rating

High density memory card assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density memory card assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density memory card assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2769993