High density 3-D integrated circuit package

Details High density 3-D integrated circuit package High density 3-D integrated circuit package

2005-10-25

2005-10-25

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

06958533

ABSTRACT:
A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.

REFERENCES:
patent: 3614541 (1971-10-01), Farrand
patent: 3631325 (1971-12-01), Wenz
patent: 4214292 (1980-07-01), Johnson
patent: 4502098 (1985-02-01), Brown et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4704319 (1987-11-01), Belanger et al.
patent: 4764846 (1988-08-01), Go
patent: 4868712 (1989-09-01), Woodman
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4983533 (1991-01-01), Go
patent: 5140405 (1992-08-01), King et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5222014 (1993-06-01), Lin
patent: 5266833 (1993-11-01), Capps
patent: 5276590 (1994-01-01), Budman et al.
patent: 5514904 (1996-05-01), Onga et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5688721 (1997-11-01), Johnson
patent: 5701233 (1997-12-01), Carson et al.
patent: 5754405 (1998-05-01), Derouiche
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5838060 (1998-11-01), Comer
patent: 5943213 (1999-08-01), Sasov
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6014316 (2000-01-01), Eide
patent: 6028352 (2000-02-01), Eide
patent: 6072234 (2000-06-01), Camien et al.
patent: 6117704 (2000-09-01), Yamaguchi et al.
patent: 6207474 (2001-03-01), King et al.
patent: 6281577 (2001-08-01), Oppermann et al.
patent: 6314541 (2001-11-01), Seytter et al.
patent: 6457515 (2002-10-01), Vafai et al.
patent: 6507109 (2003-01-01), Kinsman
Gann, Keith D. “Neo-Stacking Technology”HDI MagazineDec. 1999.

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