High performance heat spreader for flip chip packages
High performance integrated circuit chip package
High performance multi-chip flip chip package
High performance multi-chip flip chip package
High performance multi-chip flip package
High performance package using high dielectric constant material
High performance packaging for microprocessors and DRAM...
High performance power and ground edge connect IC package
High performance reworkable heatsink and packaging structure...
High performance reworkable heatsink and packaging structure...
High performance semiconductor device with resin substrate and m
High performance semiconductor package with area array leads
High performance silicon contact for flip chip
High performance substrate, electronic package and integrated ci
High performance vias for vertical IC packaging
High performance, low cost microelectronic circuit package...
High pin count package for semiconductor device
High power chip scale package
High power MCM package with improved planarity and heat...
High power microwave transistor amplifier