High performance semiconductor device with resin substrate and m

Details High performance semiconductor device with resin substrate and m High performance semiconductor device with resin substrate and m

1995-01-03

1996-12-10

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257698, H01L 2314

Patent

active

055833764

ABSTRACT:
High performance semiconductor devices, such as those used to package microprocessor integrated circuits, demand materials with excellent electrical, physical and chemical properties. Polymethylpentene (PMP) compositions provide resin substrates for high performance devices with a material which has a low dielectric constant and a low dissipation factor. In addition, PMP has very low moisture absorption, and good mechanical stability under repeated thermal stress, which will help keep the device from cracking and warping during high temperature assembly processes and constant use.

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 5216278 (1993-06-01), Lin et al.
patent: 5325583 (1994-06-01), Shimizu et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5475264 (1995-12-01), Sudo et al.

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