Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-02-27
1997-04-29
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257719, 257697, 361704, 361707, 361709, 361714, H01L 2334, H05K 720
Patent
active
056252285
ABSTRACT:
A package for high performance semiconductor devices is disclosed. The package has area array leads which can be pins, solder balls, or conductive pads. The package provides increased electrical and thermal performance at a cost that is less than that of previous technology. The packages is comprised of a printed wiring board type substrate to provide multilayer electrical connections and a thermally conductive case that encloses the top surface and the edges of the wiring substrate. The semiconductor device can be mounted directly on the thermally conductive case and connected to the substrate by any of the common methods for making first level interconnections. In the preferred embodiment, the case is comprised of copper or a copper alloy that is treated to enhance appearance and to prevent oxidation of the surface of the case. In addition to enhancing the thermal properties of the package, the copper case can also serve as a very low noise ground plane. The forged metal case with integral design features and appropriate surface finishes significantly enhance the appearance and perceived value of the package.
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