High performance heat spreader for flip chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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Details

257712, 257717, 257737, 257738, 257787, 257707, 257796, 257722, 438122, 438121, 361386, H05K 334, H01L 2302

Patent

active

059090561

ABSTRACT:
According to one aspect of the invention, a semiconductor package is provided including a package substrate having an upper surface and a lower surface, wherein electrical contacts on the lower surface of the substrate are coupled to corresponding electrical contacts on a printed circuit board by a plurality of solder balls; a semiconductor die having a non-active surface and an active surface, wherein the active surface is electrically coupled to the upper surface of the package substrate by a plurality of solder bumps; and an integrated heat spreader and ring stiffener coupled with the non-active surface of the semiconductor die by a phase change material which is retained by a miniature dam ring while in a liquid state, wherein heat generated by the die is transferred to the heat spreader, and wherein the heat spreader has a protrusion formed thereon which matches the outermost size of the die.

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