Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-06-03
1999-06-01
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257712, 257717, 257737, 257738, 257787, 257707, 257796, 257722, 438122, 438121, 361386, H05K 334, H01L 2302
Patent
active
059090561
ABSTRACT:
According to one aspect of the invention, a semiconductor package is provided including a package substrate having an upper surface and a lower surface, wherein electrical contacts on the lower surface of the substrate are coupled to corresponding electrical contacts on a printed circuit board by a plurality of solder balls; a semiconductor die having a non-active surface and an active surface, wherein the active surface is electrically coupled to the upper surface of the package substrate by a plurality of solder bumps; and an integrated heat spreader and ring stiffener coupled with the non-active surface of the semiconductor die by a phase change material which is retained by a miniature dam ring while in a liquid state, wherein heat generated by the die is transferred to the heat spreader, and wherein the heat spreader has a protrusion formed thereon which matches the outermost size of the die.
REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4914551 (1990-04-01), Anschel et al.
patent: 4987478 (1991-01-01), Braun et al.
patent: 5359768 (1994-11-01), Haley
patent: 5387815 (1995-02-01), Nishiguchi
patent: 5510956 (1996-04-01), Suzuki
patent: 5523586 (1996-06-01), Sakurai
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5615086 (1997-03-01), Collins et al.
patent: 5625226 (1997-04-01), Kinzer
patent: 5699227 (1997-12-01), Kolman et al.
patent: 5706171 (1998-01-01), Edwards et al.
patent: 5724230 (1998-03-01), Poetzinger
patent: 5724729 (1998-03-01), Sherif et al.
IBM Technical Disclosure Bulletin vol. 34 No. 7B Aluminum Nitride Cap Design Obviating Problems of Thermal Conductivity and TEC Associated with Polymer-Ceramic Substrate, Dec. 1991.
LSI Logic Corporation
Williams Alexander Oscar
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