Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-09-30
1995-01-31
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 165 804, 16510433, 361700, H01L 2504
Patent
active
053861434
ABSTRACT:
Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the porous ceramic body (14). A heat transfer liquid (18) partially fills pores (30) of the porous ceramic body (14). A plurality of integrated circuit chips (20) are attached to a surface of the substrate (12) by epoxy, solder or other bonds (22). On an opposite surface, the substrate (12) includes a plurality of heat transfer fins (24). In use, the heat transfer liquid (18) in the ceramic body (14) is vaporized to fill the balance of the pores (30) and condensed in a continuous heat pipe cycle to remove heat from the integrated circuits (20) mounted on the substrate.
REFERENCES:
patent: 3840069 (1974-10-01), Fischer et al.
patent: 3911547 (1975-10-01), Vinz
patent: 3984861 (1976-10-01), Kessler, Jr.
patent: 4135371 (1979-01-01), Kesselring et al.
patent: 4194559 (1980-03-01), Eastman
patent: 4212349 (1980-07-01), Andres et al.
patent: 4523636 (1985-06-01), Meijer et al.
patent: 4627487 (1986-12-01), Basiulis
patent: 4671349 (1987-06-01), Wolk
patent: 4727455 (1988-02-01), Neidig et al.
patent: 4884627 (1989-12-01), Abtahi
Dunn, P., "Heat Pipes," Pergamon Press.
Gerner, Frank M., "Final Report, Micro Heat Pipes", 1989 Research Initiation Program, Dec. 20, 1990.
Babin, B. R., et al., "Analysis and Testing of a Micro Heat Pipe During Steady-State Operation", The American Society of Mechanical Engineers, Aug. 5-8, 1989.
Fox, L. R., et al., "Multichip Package Cooling With Integral Heat Pipe", Digital Equipment Corporation.
Ogniewicz, Y., et al, "Porous Heat Pipe", Heat Transfer, Thermal Control, and Heat Pipes, vol. 70, Progress in Astronautics and Aeronautics, 1979.
Cefalo Albert P.
Digital Equipment Corporation
Limanek Robert P.
Maloney Denis G.
Ostrowski David
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