High performance reworkable heatsink and packaging structure...

Details High performance reworkable heatsink and packaging structure... High performance reworkable heatsink and packaging structure...

2008-03-11

2008-03-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23098, C257SE23087, C257SE23107, C257S713000, C257S717000, C257S718000, C257S719000, C257S720000, C257S721000, C257S722000, C361S688000

Reexamination Certificate

active

11316264

ABSTRACT:
A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

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patent: 2007/0068173 (2007-03-01), Sauciuc et al.
patent: 2007/0134948 (2007-06-01), Brodsky et al.

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