High performance, low cost microelectronic circuit package...

Details High performance, low cost microelectronic circuit package... High performance, low cost microelectronic circuit package...

2005-05-03

2005-05-03

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S924000, C257S778000, C257S691000, C257S698000, C257S787000, C257S777000, C257S697000

Reexamination Certificate

active

06888240

ABSTRACT:
A low cost technique for packaging microelectronic circuit chips fixes a die within an opening in a package core. At least one metallic build up layer is then formed on the die/core assembly and a grid array interposer unit is laminated to the build up layer. The grid array interposer unit can then be mounted within an external circuit using any of a plurality of mounting technologies (e.g., ball grid array (BGA), land grid array (LGA), pin grid array (PGA), surface mount technology (SMT), and/or others). In one embodiment, a single build up layer is formed on the die/core assembly before lamination of the interposer.

REFERENCES:
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5055532 (1991-10-01), Hoffman et al.
patent: 5105257 (1992-04-01), Michii
patent: 5346858 (1994-09-01), Thomas et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5424250 (1995-06-01), Sawada
patent: 5508229 (1996-04-01), Baker
patent: 5523622 (1996-06-01), Harada et al.
patent: 5608262 (1997-03-01), Degani et al.
patent: 5701032 (1997-12-01), Fischer et al.
patent: 5707894 (1998-01-01), Hsiao
patent: 5798567 (1998-08-01), Kelly et al.
patent: 5864470 (1999-01-01), Shim et al.
patent: 5870822 (1999-02-01), Drake et al.
patent: 5892287 (1999-04-01), Hoffman et al.
patent: 5939782 (1999-08-01), Malladi
patent: 6002163 (1999-12-01), Wojnarowski
patent: 6014317 (2000-01-01), Sylvester
patent: 6025275 (2000-02-01), Efland et al.
patent: 6049465 (2000-04-01), Blish, II et al.
patent: 6060777 (2000-05-01), Jamieson et al.
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6084777 (2000-07-01), Kalidas et al.
patent: 6130478 (2000-10-01), Dumoulin et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6162652 (2000-12-01), Dass et al.
patent: 6204074 (2001-03-01), Bertolet et al.
patent: 6222246 (2001-04-01), Mak et al.
patent: 6239482 (2001-05-01), Fillion et al.
patent: 6242282 (2001-06-01), Fillion et al.
patent: 6262579 (2001-07-01), Chazan et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6277669 (2001-08-01), Kung et al.
patent: 6284566 (2001-09-01), Lee et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6291775 (2001-09-01), Saitoh
patent: 6309912 (2001-10-01), Chiou et al.
patent: 6316830 (2001-11-01), Lin
patent: 6333565 (2001-12-01), Hashimoto
patent: 6346743 (2002-02-01), Figueroa et al.
patent: 6361959 (2002-03-01), Beroz et al.
patent: 6388333 (2002-05-01), Taniguchi et al.
patent: 6590291 (2003-07-01), Akagawa
patent: 20010013654 (2001-08-01), Kalidas et al.
patent: 20020008314 (2002-01-01), Takeuchi
patent: 20020070443 (2002-06-01), Mu et al.
patent: 20020158334 (2002-10-01), Vu et al.
patent: 0149317 (1984-11-01), None
patent: 0361825 (1989-09-01), None
patent: 0431205 (1989-12-01), None
patent: 0476971 (1992-03-01), None
patent: 0611129 (1994-08-01), None
patent: 0777274 (1997-06-01), None
patent: 0877419 (1998-11-01), None
patent: 1111662 (2001-06-01), None
patent: 2174543 (1986-11-01), None
patent: 62-004351 (1987-01-01), None
patent: 10125721 (1998-05-01), None
patent: 11204688 (1999-07-01), None
patent: 2000243870 (2000-09-01), None
patent: 2000307005 (2000-11-01), None
patent: 2000-349203 (2000-12-01), None

Affiliated with

Also associated with

Rating

High performance, low cost microelectronic circuit package... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High performance, low cost microelectronic circuit package..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance, low cost microelectronic circuit package... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3440676