High performance power and ground edge connect IC package

Details High performance power and ground edge connect IC package High performance power and ground edge connect IC package

1997-09-04

1999-04-06

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257691, 257692, 257785, 439249, H01L 2348

Patent

active

058922750

ABSTRACT:
An integrated circuit package that receives power from a connector clipped to an edge of the package. The IC package has at least one pair of contact strips that extend along an edge of the package. The strips are connected to the power and ground pads of the integrated circuit by internal routing of the package. The connector has a plurality of conductive spring fingers that clip onto the contact strips of the package. The connector supplies power to the package through a cable connected to an external power supply. The package may have a number of separate connectors that provide different voltage levels to the integrated circuit. The IC package may have a plurality of contacts that extend from the package and are mounted to a printed circuit board.

REFERENCES:
patent: 3912353 (1975-10-01), Kasuya et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5266833 (1993-11-01), Capps
patent: 5306948 (1994-04-01), Yamada et al.
patent: 5391922 (1995-02-01), Matsui

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